Plate type: Positive-working digital thermal offset plateMin. plate width: 200 mmMax. plate width: 1250 mmMin. plate length: 300 mmPlate thickness: 0.15 - 040 mmPlatesetters: 830nm Thermal PlatesettersPlate speed: 160 cm/min.Plate throughput: 95 plates/h (landscape)Plate throughput: 67 plates/h (portrait)Processor sectionsThe basis processor contains four major sections:1 Developer Developing of the plate and removing of the remaining unexposed/-exposed emulsion.2 Wash Washing off the developer chemicals from the developed plate.3 Gum Application of a thin layer of gum onto the developed and washed plate toprotect it from oxidation, dirt, fingerprints etc.4 Dryer Drying of the plate to ensure immediate handling of the plate.