Plate type: Positive-working digital thermal offset plate <>Min. plate width: 200 mm <>Max. plate width: 1250 mm <>Min. plate length: 300 mm <>Plate thickness: 0.15 - 040 mm <>Platesetters: 830nm Thermal Platesetters <>Plate speed: 160 cm/min. <>Plate throughput: 95 plates/h (landscape) <>Plate throughput: 67 plates/h (portrait) <>Processor sections <>The basis processor contains four major sections: <>1 Developer Developing of the plate and removing of the remaining unexposed/- <>exposed emulsion. <>2 Wash Washing off the developer chemicals from the developed plate. <>3 Gum Application of a thin layer of gum onto the developed and washed plate to <>protect it from oxidation, dirt, fingerprints etc. <>4 Dryer Drying of the plate to ensure immediate handling of the plate.